Hai-Voltej Silva Plet BUSBAR Teminal Stamping Dai bilong NEV Pawa Tren Sistem
Precision Engineering bilong Hat bilong NEV Pawa
Insait long ol nupela eneji kar (NEVs) we i wok long senis hariap tru, pawa tren sistem i nidim ol samting we i no gat wankain olsem ol i ken wok gut, wok gut, na seif. Long as bilong hai-pawa pawa distribusen insait long ol dispela sistem i gat BUSBAR terminal. High-Voltage Silver Plated BUSBAR Terminal Stamping Die bilong mipela em i no wanpela tul tasol; em i wanpela gutpela rot bilong wokim ol bikpela 'conductive links' we i save givim pawa long neks jeneresen bilong lektrik mobiliti. Mipela i save long wokim ol 'precision stamping dies' we i save senisim 'high-conductivity Oxygen-Free Copper' i go long ol 'complex', 'high-tolerance BUSBAR terminals, na ol i pinisim wantaim wanpela 'consistent', 'high-performance silver plating, olgeta i stret long ol strongpela wok bilong NEV.
Dispela dai i soim komitmen bilong mipela olsem wanpela China-bes, sos-tooling manifakta long givim gutpela enjiniaring, hariap senis, na gutpela veliu na i no bagarapim ol strongpela kwaliti standet we ol global otomotiv na ilektroniks indastri i laikim.
Ol spesifikasen bilong prodak na ol bikpela samting
Dispela tebol i soim ol bikpela samting na ol samting we mipela i ken mekim long dispela bikpela samting:
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Paramita |
Spesifikasen / Diskripsen |
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Nem bilong prodak |
Hai-Voltej Silva Plet BUSBAR Teminal Stamping Dai bilong NEV Pawa Tren Sistem |
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Ol samting bilong prodak |
Oxygen-Free Copper T2 (C11000), Thickness=1.5mm (Yu ken stretim long wanwan piksa: 0.8mm - 3.0mm) |
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Rot bilong Stapim |
Progressive Stamping Die (Fully Automated, High-Speed) |
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Struksa bilong dai |
Modular, Precision-Guided Progressive Die. I gat ol kwik-sen inset, ol 'guided punch plates', na ol indipenden lifta sistem bilong daunim taim na isi mentenens. |
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Tritmen bilong pes (Hap) |
0.5μm Silva (Ag) Leya Minimum. Ol i wokim 'die' bilong mekim 'plating' i pas gut na stopim 'peeling' o 'inconsistency' long laspela hap we ol i bin stampim. |
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Ki Prosesing Tek |
Precision Grinding, High-Speed Wire-Cutting (HS-WEDM), CNC Machining, Profile Grinding, Electrical Discharge Machining (EDM). |
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Prodaksen Kapasiti |
Inap long sapotim bikpela - prodaksen ran we i winim10 milien hap long wan wan mun, i dipen long hevi bilong hap na 'press tonnage'. |
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Ol standet bilong ol tul |
I yusim ol nambawan intanesenel standet:Meusburger, Hasco, Misumi, naDMEbilong ol 'mold bases', ol 'guide components', na ol samting bilong en, na dispela i mekim na ol i ken senisim na yusim long olgeta hap. |
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Die Material |
Premium Tool Steels & Carbides: SKD11 (bilong ol 'punch'/foma), CD650 (ol 'high-wear inserts'), ASP23/ASP60 (bilong ol 'high-speed', 'long-run' aplikesen), Ceratizit CF-H40S (carbide bilong ol 'extreme wear areas'). |
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Ol Aplikesen we ol i makim |
NEV (BEV, PHEV) Powertrain Systems (Battery Packs, Inverters, DC-DC Converters, On-board Chargers). Aerospace Power Distribution, Medical Imaging Equipment, High-Precision Industrial Control Systems, Advanced Precision Electronic Connection. |
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Guaranteed Die Life |
10 milien strok minimamaninit long ol standet mentenens protokol, tenkyu long ol gutpela samting, stretpela hat tritmen, na strongpela disain. |
Gutpela samting bilong mipela: Bespoke Precision Metal Stamping Die Divelopment
Mipela i no wanpela saplaia bilong ol tul tasol; mipela i patna bilong yu long kamapim ol prodak na tul. Strong bilong mipela i stap long tanim tingting na ol spesifikesen bilong yu i go long wanpela hai-pefomens, strongpela stamping dai.
Komprehensiv Enjiniaring Sevis: Long ol namba wan 2D/3D hap droing bilong yu (IGES, STEP, CATIA, UG, SolidWorks fomat), tim bilong mipela i gat save long disain enjinia i save mekim wanpela gutpela DFM (Disain bilong Wokim) Analisis. Mipela i luksave long ol hevi we inap kamap, givim tingting long ol rot bilong stretim kos na pefomens, na mekim gut olsem disain bilong hap i gutpela long mekim 'high-yield stamping.
Virtual Validation wantaim CAE Simulation: Pastaim long katim wanpela ain, mipela i save yusim CAE (Computer-Aided Engineering) Forming Simulation (yusim sofwet olsem AutoForm o Dynaform). Dispela bikpela step i save toksave long ron bilong ol samting, 'stress/strain distribution', 'potential thinning', 'springback', na i save rausim ol bikpela hevi bilong traim - na -. Mipela i save stretim ol hevi long 'virtual' stej, na dispela i save mekim gutpela rot i go long wanpela gutpela 'physical tool'.
Integreted Divelopmen Proses: Ful-spektrum sevis bilong mipela i mekim projek i ron gut:
Ol tulDisain: 3D/2D dai straksa disain wantaim ol ditel layout.
Seleksen bilong ol samting: Givim toksave long gutpela 'tool steel'/carbide bihainim ol samting bilong hap, volium, na ol nid bilong stretpela wok.
Precision Manufacturing: Ol promis bilong mipela long sait bilong enjiniaring na kwaliti i gat bikpela invesmen long ol gutpela teknoloji bilong wokim ol samting na skelim ol samting, Bikpela lista i stap daunbilo:
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Kain Ikwipmen |
Model na namba |
Ki Kapabiliti / Presisen |
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EDM (Sinker) |
Sodick AD32LS, Makino EDG2/EDG3 (6 yunit olgeta) |
Kompleks 'cavity machining', 'surface finish' Ra<0.4μm. |
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Waia-Katim EDM |
Sodick AQ360LS, Seibu M50B (7-pela yunit olgeta) |
Hai-spid 'precision cutting', 'taper cutting', 'positioning accuracy' ±0.002mm. |
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'Surface Grinder' |
Yutong 618S (10 yunit) |
Gutpela 'grinding' bilong ol 'flat surface', 'parallelism' insait long 0.002mm. |
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Profail Grinda |
Waida (2 yunit) |
Gutpela wok bilong grisim ol kompleks 'punch' na 'die' profail. |
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CMM |
Heksagon CMM Inspekta (1 yunit) |
Ful 3D dimensenel analisis, stretpela inap long (1.8+L/350)μm. |
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Optikal Projekta |
Nikon V-12B (3 yunit) |
2D 'contour measurement', 'magnification' inap long 100X. |
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Altimita |
Nikon * 8units |
Dip na Hait mesamen, +-0.001mm |
Advans Tul Rum Displei
Bungim & Traim-Aut: Ol gutpela teknisen i save bungim na mekim ol namba wan -sot traim long ol 'in-haus pres bilong mipela (25-110 Tonnage range).
Traim Prodaksen na Tuning:Mipela i save mekim ol liklik 'batch trials', skelim ol sempel wantaim ol 'precision instruments' (Hexagon CMM, Nikon Projector), na stretim 'die' long kisim gutpela sais bilong ol hap.
Mass Production Handoff: Mipela i save givim wanpela prodaksen-redi dai, wantaim olgeta pepa na ol proses paramita.
Bikpela Volium Stamping Prodaksen Sapot
Wanpela gutpela dai i nidim gutpela prodaksen envairomen. Mipela i save meksua olsem ol i ken wokim ol hap bilong yu long bikpela mak na i stap wankain.
Insait long-HausProdaksen Ikwipmen (Molding + Stamping):
- 35+ hai presisen injeksen molding masin (30T~300T) bilong nambawan bren,
- 18+ ol masin we i gat bikpela stretpela na spitpela 'progressive stamping' masin ((25T~110T) bilong nambawan bren.
- 15+ yia bilong OEM/ODM ekspiriens.
- Pinisim-i go long-pinisim ol solusen stat long disain i go inap long givim.
Dediket Prodaksen Sel: Long ol projek olsem High-Voltage BUSBAR Terminal, mipela i ken kamapim wanpela prodaksen lain, we i gat ol otometik fida, in-lain visen inspeksen, na pakejing, na mekim gutpela ron bilong koil stok i go long ol pinis, inspeksen pat.
Skelabiliti: Fasiliti na patna netwok bilong mipela i larim mipela long skruim prodaksen bilong inapim ol bikpela askim, na givim gutpela saplai sen bilong ol NEV program bilong yu.
Prodaksen Eria Displei
Strongpela Kwaliti Kontrol: I Stap Insait Long Olgeta Proses
Olsem wanpela ISO9001&IATF16949&ISO14000 setifiket faktori, Kwaliti i stap long olgeta step, stat long sekim ol samting i go inap long laspela sipmen.
Ol samting i kam insait QC
Olgeta tul stiel na standet komponen i gat setifiket na verifai long gret na dimensen.
Ful Dokumentesen
Wanpela gutpela ripot bilong sekim, we i gat ol setifiket bilong ol samting, namba wan-data bilong sekim atikol (FAI), na ol sempel hap, i save go wantaim olgeta dai we ol i givim.
In-Proses Inspeksen (IPQC)
Stet bilong wokim masin: Ol i save skelim ol bikpela samting long yusim ol Nikon projekta (3-pela yunit) na ol Nikon altimita (8-pela yunit) bihain long ol i grindim na katim waia-. Ol i save sekim 'profile grinding' long ol 'Wanhao 2D projectors' (4-pela yunit).
Pre-Asembli Sekim: Ol i sekim olgeta ditel pastaim long laspela asembli bilong lukim olsem em i fit gut.
Laspela verifikesen na stadi bilong inapim
Ol namba wan sempel bilong traim-aut ol i skelim gut tru long yusim Hexagon CMM Inspekta bilong mipela long kisim ful dimensenal ripot egensim ol GD&T kolout bilong yu.
We perform a CPK (Process Capability Index) study on critical dimensions (e.g., terminal pin width: 2.50±0.03mm, pin spacing: 5.00±0.05mm) using data from multiple consecutive strokes to statistically prove the die's stability and capability (target CPK >1.33).
Advans Prodak Testing Laboratori
Aplikesen Evidens insait long NEV Powertrain
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Sistem |
Implementesen |
Validesen Data |
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Bateri Pek |
Ol sel intakonekt teminal |
0 'field failure' insait long 500,000+ yunit (2023) |
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Motor Kontrola |
Ol SiC Inveta Teminal |
175 digri kontiniu operesen i bin kamap orait |
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PDU |
Bikpela Distribusen Yunit |
I winim 50kA sot-seket tes (ISO 6469-3) |
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Multi-Domain Controller |
Ol 'Zonal Gateway Connectors' |
EMC shielding >60dB @ 1GHz |
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Sasim ples |
CCS Combo Interface |
10,000 mating cycles @ IP6K9K reiting |
Teknikel Patnasip Fremwok
Kes Stadi
Aplikesen Projek
800V pletfom bilong Tier 1 saplaia bilong BYD Blade Battery Systems
01
Diliveri Pefomens
Insait long-haus tul divelopmen+30de tul redi long mas prodaksen
02
Kwaliti Pefomens
Mi bin holim 0 PPM insait long 18-pela mun
03
Dimand bilong wanwan yia
8M pcs
04
Bilong wanem yu mas wok bung wantaim mipela? Value i winim prais
Olsem wanpela kampani bilong wokim ol tul long Saina, mipela i save givim ol gutpela samting:
Kost-Gutpela Gutpela
Rausim ol 'intermediate markup'. Mipela i save givim ol gutpela tul long gutpela prais long rot bilong stretim gut disain, yusim ol lokal saplai sen, na wok gut.
Spid na Agility
Gutpela wok enjinia tim na menesmen straksa bilong mipela i mekim na ol i ken bekim hariap ol RFQ na ol senis long disain. Taim bilong wanpela kompleks progresiv dai olsem dispela em 8-10 wik, stat long oda i go inap long namba wan sempel.
Long-Tem Patnasip
Mipela i tingim olgeta projek olsem stat bilong wanpela longpela taim rilesensip, na givim teknikel sapot oltaim, mentenens edvais, na laipsaiklon menesmen bilong ol tul bilong yu.
Yu ken ringim mipela tude long toktok long ol samting yu nidim long 'High-Voltage BUSBAR Terminal o ol narapela 'precision stamping die'. Larim enjiniaring tim bilong mipela i givim wanpela ditel DFM analisis na wanpela kompetitiv kwotesen, na soim hau mipela i ken kamap gutpela patna bilong yu long 'precision metal stamping'.
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